GE IS215GFOIH1A IS215GFOIH1AB IS200GFOIH1A excitation controls

IS215GFOIH1A IS215GFOIH1AB IS200GFOIH1A

General Electric Enhanced Thermal Model

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Description:

The IS200GFOIH1A board is built with a single backplane connector, designated as P1.  This backplane connects the board into the rack system and allows the PCB to communicate with other units within the system.   The board also has a vertical pin connector designated as P6 that offers the chance for users to add an optional daughterboard.  This board will expand the capabilities of the GFOI board.  When the daughterboard is installed it will be held securely by four screw mounts threaded into standoffs located on the motherboard.  

The IS200GFOIH1A is populated by a number of ICs (integrated circuits) including a Xilinx Spartan XC2S50E chip that functions as an FPGA, or a field-programmable gate array.  The board also includes a switch component, four transistors, 9 TP test points, and a number of resistors, diodes, and capacitors.   The IS200GFOIH1A board has been factory drilled at each corner to allow for mounting options.  

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